Simple and precise chloride adjustment
This chloride solution allows controlled adjustment of chloride levels in copper electroforming and plating electrolytes.
The solution is calibrated so that 1 ml raises the chloride concentration by 10 ppm (10 mg/L) in the plating bath, making additions easy to calculate and measure accurately.
Additions can be measured conveniently either by volume (ml) or by weight (grams).
The product is primarily intended for users preparing plating solutions from individual components, for example when formulating an electrolyte using Electroforming Copper Base, CopperPro additives and deionised water, with or without added sulphuric acid.
Small chloride adjustments can help optimise additive performance and plating behaviour in these systems.
CopperPro additives and electrolyte components can be combined using the CopperPro Electroforming Calculator.
