CopperEase Plating Solution

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CopperEase Plating Solution is a semi-bright copper plating solution. You should use it with our CopperEase Brightener to plate ductile copper layers. Its one-part additive system makes it easier to use than other solutions. However for maximum gloss and brightness especially in recessed articles, you should look at our other solution – CopperPro Plating Solution.

You should regularly add our Copper Ease Brightener in order to maintain the brightness of your plate.

The amount of CopperEase Brightener can be calculated using its calculator which can be accessed by clicking HERE.

 

Available worldwide.

 

HS Code: 3824 99 70

After striking zinc and zincated aluminium parts with our Alkaline Copper Tank Plating Solution, or  our Alkaline Copper Brush Plating Solution, we recommend a build of to 10 microns with CopperEase Plating Solution to protect from corrosion if the part is going to be used outdoors.

Also, as the solution is used,  its acidity increases, you may wish to consider the use of Copper Tank pH Stabiliser to control its acidity especially when plating zinc and zincated aluminium (please refer to Tech Specs for more info).

This solution works best with platinum rod electrodes with anode bags.

To maintain the solutions characteristics, you’ll need to make regular additions of CopperEase Brightener. You can calculate the amount of brightener to add using the CopperEase Calculator.

CopperEase Plating Solution

How to use this calculator :

1. In the first box, enter the thickness that you want your item to be plated to in microns.

2. In the second box, enter the surface area of the article in square centimetres (cm2).

3. Click the ‘Calculate’ button.

4. Read off the amp setting for your rectifier and the plating time.

5. If using our Coulometer, note the number of coulombs you should plate to.

6. If using an amp-hour meter, take a note of the amp-hours you should plate to.

7. Then read off the volume or weight of CopperEase Brightener to add.

8. Finally read off the weight of copper that’s plated if you wish to confirm the final average thickness using the weight increase method.

Operating Conditions and Deposit Data

Plating Factor 0.02 – 0.04A/cm2 (optimum: 0.035 A/cm2
Plating rate 0.7 micron per minute at 0.035A/cm2
Temperature 18 – 30°C  (optimum 26°C) (see note 1)
Agitation Medium to high
Filtration Occasional batch filtration may be necessary to remove extraneous particulate contamination (see note 3
Visual qualities of deposit Bright to semi-bright depending on thickness (see note 4)
Cathode efficiency Above 99% at Plating Factor = 0.035A/cm2
Hardness of deposit 160 VPN falling to 100 VPN over 5 days at room temp
Density of deposit 8.9 g/cm3
Stress Low (Tensile)
Special storage requirements None
Shelf life Over 2 years
Health and Safety classification Harmful
Transport (UN number) Copper Tank Plating Solution is not classified as dangerous for transport.

 

Notes:

 

    1. Higher temperatures favour less burning on exposed areas ie: sharp edges or pointed parts.
    2. We have designed this solution for use with insoluble electrodes (preferably platinised titanium). This solution only requires the minimal of filtration because it doesnt’s produce
      any sludge as with conventional systems using copper anodes.
    3. Thinner layers up to 10 microns plated on bright surfaces tend to dublicate the brightenss of the underlying surface. Thicker layers, especially in lower current density areas tent to be semi bright.
    4. If plating other metals over copper plated from this solution, you will need to remove the organic layer which is deposited during copper plating otherwise you’ll experience poor adhesion.
      This is best done by mechanically polishing or abrading the article and then power cleaning.

General guide;

Certain small items, for example Swabs, Nibs and Plating Pens can be sent by normal post within the UK

  • The courier option for UK deliveries is FedeX and APC. Delivery times range usually from 2 – 5 working days.
  • Royal Mail option is available on a limited range of non-liquid orders. Delivery from 5 – 10 working days.
  • Free UK mainland delivery available on orders over £200
  • International orders usually 5 – 10 working days.

For all price quotations for deliveries, please add your items to our shopping cart. You will be able to see the shipping costs by clicking on the ‘Calculate shipping’ button in the cart and before checking out.

Please click on the link below to download the SDS for this product:

https://www.goldn.co.uk/msds/copper_ease_plating_solution.pdf

Fault

Possible cause

Corrective action
No plating at all.
 Electricity not flowing Check that the the rectifier is switched on, that volts are showing and that the circuit is switched on (see manual).
Check all electrical contacts and clean if necessary.
Conductive layer has broken with the main jigging wire breaking the electrical circuit. Remove from the process, rinse and dry.
Repair the brocken circuit with Conductive Paint and allow to cure.
Replace in tank and start off at half the calculated amp setting for the first 5 minutes. This will allow enough copper to plate to carry the amps.
After
5 minutes, increase to the calculated amp setting.
No plating. Item looks damaged on removal from plating process
 Leads connected wrongly. Check that the black connection from the rectifier is connected to the work piece and the red connection to the Beaker Ring.
Dullness of plate in the middle of articles and recesses.
 Amp setting too low

 

 Increase the amp setting until brightness returns.
Lack of brightener. Add 2ml of Copper Electroforming Brightener for every litre of solution and check for difference.
If no difference is observed after a third addition, do not add any more.
Temperature too high.

 

 Reduce temperature to within operating range (see Tech Specs)
Low conductivity. The bath starts off at a lower conductivity. The conductivity will increase as the bath is used (using our Platinum Rod Electrodes) and brightness distribution will also increase.
Copper content too high. Lower the copper content by allowing to plate out without making Copper Electroforming Replenisher additions.

 
Deposit dull all over.
 Organic contamination Treat with Carbon Powder (see shop). Once complete, add 5ml of Copper Electroforming Brightener for every litre of solution treated.
Run the plating bath until full brightness resumes.
Burnt deposit especially on corners and edges. Nodular in extreme cases.
 Amp setting too high.

 

 Decrease the amp setting.
Article too close to the anode. Move the item in the beaker or rearrange the anodes.

 
Low copper content evident in clearness of solution. Add Copper Electroforming Replenisher at 40 grams for every litre.
Repeat until original solution colour has returned.
Too little agitation. Increase agitation.

 
Temperature too low. Increase temperature. Please note that deposit will become less bright if the temperature is raised over 25 centigrade.

 
Matt deposit, rough in extreme cases.
 Particulate contamination especially in small installations without continuous filtration. Filter solution into a clean beaker/container.
Pitting of deposit – small holes which can become larger on further plating.
 Fit anode bags.  

 
Particulate matter in solution. Filter.

 
Grease or oil contamination in solution. Treat with Carbon Powder as above.

 
Un-plated area (step or skip plating).

 

 Improper cleaning Check cleaning cycle especially for water breaks (see Online Manual)
Vertical tide marks especially evident on thin, flat articles.
 Laminar nature of agitation especially when stirring. Consider using a stirrer with reversing action in order to make the agitation more turbulent.

 
Streaking of deposit.
 Excessive brightener additions.

 

 Plate out without adding brightener.
Organic contamination.

 

 Treat with Carbon Powder as above.
Contaminated rises or lack of rinsing.

 

 Extend rinsing cycle.
Deposit peels from basis metal.
 Improper cleaning.

 

 Check the cleaning cycle for the metal (see Online Manual).
Check the type of metal being plated. Consider gold flash intermediate coating especially of plating on brass, steel or stainless steel (refer to Online Manual for a list of pre-treatment stages).

Plating on zinc (also see notes below)

  • Degrease
  • Electroclean
  • Rinse
  • Microetch in Activator for 20 – 30 seconds
  • Rinse
  • Plate for 5 minutes at plating factor 0.01 A/cm2

You can now leave the surface with its matt/satin finish or hand polish using Autosol.
You can also apply either tank or brush plated layers.
If the item is likely to be used outdoors, then we advise a copper layer of 5 – 10 microns
which can be plated quickly using CopperEase Plating Solution.
If nickel tank plating, polishing may not be necessary as the nickel brightens as it plates.

Plating on to Aluminium

  • Degrease
  • Electroclean
  • Rinse
  • Zincate in Zincate Dip for 30 seconds to 2 minutes
  • Rinse
  • Plate for 5 minutes at plating factor 0.01 A/cmhttps://www.goldn.co.uk/product/zincate-dip-uk-and-eu

The same post plating options apply as for zinc above.

Plating on to steel

  • Degrease and remove any traces of rust
  • Electroclean
  • Rinse
  • Dip in Activator or ActiClean for 30 seconds – 1 minute
  • Rinse
  • Plate for 3 – 5 minutes at plating factor 0.01 A/cm
  • Rinse and plate in CopperEase Plating Solution to the thickness you require

Plating on to brass, bronze, pewter and other tin based alloys

  • Degrease
  • Electroclean
  • Rinse
  • Dip in Activator or ActiClean for 30 seconds – 1 minute
  • Rinse and plate in CopperEase Plating Solution to the thickness you require

Notes
1) Please note that the Activator dip should be kept exclusive to a single metal for example, if the Activator
has been used for zinc, it is not advisable to use the same solution for steel.
2) Most zinc is cast and contains surface impurities that need to be mechanically removed to achieve good adhesion.
This can be done in a variety of ways including abrading, polishing or tumbling in a barrel with abrasive medium added.
Poorly prepared zinc usually results in deposits which bubble up.
3) For maximum adhesion, we advise a quick power clean (30 seconds) followed by a dip in Activator or Acticlean after plating with CopperEase Plating Solution and before continuing to any further plating process.

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