Copper Electroforming Solution (export outside UK and EU only)

£18.97£57.88 + VAT

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For export outside the UK and the EU only. Requires further additions in order for it to function. Please refer to the Tech Specs and Product Details tabs nest to this for more information. A Copper Electroforming Solution that will quickly build a thick, bright and smooth layer of pure copper and will work with most other copper plating solutions.

Please click on the Tech Specs tab for more information including using our brightener with home-made copper electroplating and electroforming solutions.


HS Code: 3824 99 70

One litre of our Copper Electroforming Solution (Export Only) is capable of plating 25 golf balls to a thickness of 100 microns. Quickly builds a shiny layer of copper without the need for post plating polishing. Our electroforming solution contains a tarnish inhibitor which means it keeps its shine for longer – just rinse and dry after plating.

In order for this product to be sent by air, we have removed the sulphuric acid component from the preparation. Once received, you can add the sulphuric acid component providing you can find a source of battery acid locally.

The procedure for making one litre of working solution can be found by clicking on the Tech Specs tab.

Please note: It is possible to use our Copper Electroforming Brightener with home-made sulphuric acid base copper electroforming and copper plating solutions provided that the solution has not had any brighteners added previously.
For home-made solutions add 25ml of Copper Electroforming Brightener for every litre of home-made solution.

Copper Electroforming Calculator

How to use this calculator :

1. In the first box, enter the thickness that you want your electroform to be plated to. (thousandths of a millimetre).

2. In the second box, enter the surface area of the article in square centimetres (cm2).

3. In the third box, enter the volume of solution that you are using.

4. Click the ‘Calculate’ button.

5. Read off the amp setting for your rectifier and the plating time.

7. The volume of Copper Electroforming Brightener to add.

8. The weight of Copper Electroforming Replenisher to add (Only applicable when using Platinum Rod Electrodes).

9. The bath usage. This figure is the percentage of the total bath life expectancy when
using Platinum Rod Electrodes.

If you’re using Platinum Rods for anodes, we highly recommend our Copper Electroforming Solution Tracker
which can be downloaded by clicking HERE.
This will help you keep track of the life of the bath and estimate when it’s time to renew it.

Operating Conditions, Deposit Data and Preparation Instructions

Plating Factor 0.05 A/cm2
Plating rate 1.0 micron per minute at 0.05A/cm2
Temperature 21 – 30°C (See notes)
pH <1.0
Agitation Low (slow spin speed on stirrer) See notes below
Brightener Single brightener. Initial concentration: 25ml/litre
Electrode (bagged) Copper Electrode for Tank Plating recommended
Cathode efficiency Above 98% at Plating Factor = 0.03A/cm2
Hardness of deposit 160 VPN falling to 100VPN over 5 days at room temp
Density of deposit 8.9 g/cm3
Stress Low (Tensile)
Special storage requirements None
Shelf life 1 – 2 years
Health and Safety classification Corrosive
Transport (UN number) 2796



  • Brightener additions should be made at the start of plating if possible. Additions can
    be determined using the Copper Electroforming Calculator by clicking on the ‘Calculator’ tab above.
  • Higher temperatures favour less burning on exposed areas ie: sharp edges or pointed parts.
  • Solution should only be lightly agitated with the stirring rate set to minimum. Too much
    agitation will disturb any copper residues in the anode bags causing them to enter the
    solution which will produce a rough deposit.
  • After starting from a long period of inactivity, add 5ml of Copper Brightener per litre of
    electroforming solution.
  • Build up of blue crystals is usual on the electrode ring. Remove by scraping them
    back into the solution and allow to dissolve before commencing plating.
  • If particulate contamination enters the solution – example from excessive agitation
    disturbing contents of anode bags – filter using our filter kit. Make sure to thoroughly rinse
    the anode bags.
  • Please note: It is possible to use our Copper Electroforming Brightener with home-made
    sulphuric acid base copper electroforming and copper plating solutions provided that the
    solution has not had any brighteners added previously.
    For home-made solutions add 25ml of Copper Electroforming Brightener
    for every litre of home-made solution.


To prepare 1 litre of working solution from 800ml of Copper Electroforming (Export Only)


1. Add 800ml of Copper Electroforming Export to a 1 litre graduated beaker or measuring cylinder.

2. Add 135 millilitre of Battery Acid (35%). See notes below.

3. Make up to 1 litre with distilled or deionised water. See notes below

4. Add to plating beaker or store in original bottle.


If 35% sulphuric acid is not available, please contact us with the percentage which
is available and we will advise on the addition accordingly.

Water for filling steam irons or water for topping up lead acid batteries can be used.

General guide;

Certain small items, for example Swabs, Nibs and Plating Pens can be sent by normal post within the UK

  • The courier option for UK deliveries is FedEx
  • Free UK mainland delivery available on orders over £200
  • International orders usually 3-5 working days.

For all price quotations for deliveries, please add your items to our shopping cart. You will be able to see the shipping costs by clicking on the ‘Calculate shipping’ button in the cart and before checking out.

You can access our MSDS by scanning the QR code which is on our product bottles.
Here is a video to show you how;


Possible cause

Corrective action

No plating at all.
Electricity not flowing Check that the the rectifier is switched on, that volts are showing and that the circuit is switched on (see manual).
Check all electrical contacts and clean if necessary.
Conductive layer has broken with the main jigging wire breaking the electrical circuit. Remove from the process, rinse and dry.
Repair the brocken circuit with Conductive Paint and allow to cure.
Replace in tank and start off at half the calculated amp setting for the first 5 minutes. This will allow enough copper to plate to carry the amps.
5 minutes, increase to the calculated amp setting.
No plating. Item looks damaged on removal from plating process
Leads connected wrongly. Check that the black connection from the rectifier is connected to the work piece and the red connection to the Beaker Ring.
Dullness of plate in the middle of articles and recesses.
Amp setting too low


Increase the amp setting until brightness returns.
Lack of brightener. Add 2ml of Copper Electroforming Brightener for every litre of solution and check for difference.
If no difference is observed after a third addition, do not add any more.
Temperature too high.


Reduce temperature to within operating range (see Tech Specs)
Low conductivity. The bath starts off at a lower conductivity. The conductivity will increase as the bath is used (using our Platinum Rod Electrodes) and brighteness distribution will also increase.
The conductivity can be increased by adding sulphuric acid, but this must be done by a qualified person.
Copper content too high. Lower the copper content by allowing to plate out without making Copper Electroforming Replenisher additions.


Deposit dull all over.
Grease or oil contamination. Treat with Carbon Powder (see shop).
Add 10ml of Copper Electroforming Brightener for every litre of solution treated.
Run the plating bath until full brightness resumes.
Burnt deposit especially on corners and edges. Nodular in extreme cases.
Amp setting too high.


Decrease the amp setting.
Article too close to the anode. Move the item in the beaker or rearange the anodes.


Low copper content evident in clearness of solution. Add Copper Electroforming Replenisher at 40 grams for every litre.
Repeat unti original solution colour has returned.
Too little agitation. Increase agitation.


Temperature too low. Increase temperature. Please note that deposit will become less bright if the temperature is raised over 25 centigrade.


Matt deposit, rough in extreme cases.
Particulate contamination especially in small installations without continuous filtration. Filter solution into a clean beaker/container.
If using copper anodes, scrub to remove fine particulate copper and rinse anode bags thorougly.
To prevent particulate contamination from copper anodes, consider using platinised anodes with bags.
Pitting of deposit – small holes which can become larger on further plating.
Fit anode bags. If anode bags are not fitted to the Platinum Rod Electrodes, gas bubbles will escape and adhere to the surface of the work causing gas pitting.


Particulate matter in solution. Filter.


Grease or oil contamination in solution. Treat with Carbon Powder as above.


Unplated area (step or skip plating).


Improper cleaning Check cleaning cycle especially for water breaks (see Online Manual)
Vertical tide marks especially evdident on thin, flat articles.
Laminar nature of agitation especially when stirring. Consider using a stirrer with reversing action in order to make the agitation more turbulent.


Streaking of deposit.
Excessive brightener additions.


Plate out without adding brightener.
Organic contamination.


Treat with Carbon Powder as above.
Contaminated rises or lack of rinsing.


Extend rinsing cycle.
Deposit peels from basis metal.
Improper cleaning.


Check the cleaning cycle for the metal (see Online Manual).
Check the type of metal being plated. Consider gold flash intermediate coating especially of plating on brass, steel or stainless steel (refer to Online Manual for a list of pretreatment stages).