£10.51 – £35.15 + VAT
Our Dipping Lacquer (water based) is ideal for sealing porous items before electroforming with our Copper Electroforming Kit.
It also acts as a good bonding layer for our water-based Conductive Ink (hi-grade), when brush plating onto non-conductive surfaces.
Here’s a seed pod that has been dipped in our Dipping Lacquer to provide a key layer for our Conductive Paint and to seal it for subsequent copper electroforming.
How to use our Dipping Lacquer to prepare a non-conductive surface for electroforming or brush plating.
Back to Product DescriptionOperating Conditions and Deposit Data
| Parameter | Value |
| Medium | Water based |
| Application type | Dipping |
| Finish | Gloss |
| Touch-dry time @ 25 °C | 1 – 2 hours |
| Cure time @ 25 °C | 12 hours |
| Opacity | Slightly opaque when wet, clear when dry |
| Average cured film thickness | 20 – 30 microns |
| Shelf life | Up to 2 years |
| Health and Safety classification | Not classified as harmful |
| Special considerations | None |
| Transport (UN number) | None: Not classified as dangerous for transport |
Certain small items, for example Swabs, Nibs and Plating Pens can be sent by normal post within the UK
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